The new BondCheck makes multi-mode bond testing simpler, enhancing accuracy and increasing inspection speeds.
The new BondCheck is a multi-mode bond testing flaw detector providing high speed bond inspection in pitch-catch or resonance modes, or mechanical impedance analysis (MIA), with excellent defect sensitivity. Inspection applications include those where carbon and metal honeycombs need to be inspected for delaminations, disbonds and core damage as well as small defect detection and dry coupling. The BondCheck is ideal for a wide spectrum of advanced material NDT of required in the aerospace, automotive, wind energy and advanced manufacturing sectors.
Accurate, clear and simple bond testing inspection
Product News BondCheck press release