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BONDCHECK

 

 

BondCheck BlueSc Fl 12cm

  • Supports Pitch-Catch, Resonance and MIA Bond-Testing Modes
  • Pitch and Catch Dry Coupled Bond testing mode for rapid detection of defects in laminate, bonded and sandwich structures.
  • Automatic Test Frequency Optimisation.
  • Sweep, RF, Y/T, Encoded and Phase/Frequency Plots.

 

 

 

 

BondCheck - Applications & Probe Selection 

Material

Inspection requirement

Good

Possible

Bond Stiffeners

Disbonds  

Both

Both

Carbon Laminate (multilayer)

Delaminations, Voids, Porosity

Resonance                 

Pitch-Catch

Pitch

 

 

 

Carbon or Glass reinforced pipes or pressure vessels.

Disbonds, delaminations.

Pitch-Catch

No

Carbon Overwrapped Pressure Vessels (COPV)

Disbonds, delaminations.

Pitch-Catch

No

Carbon Skin to Foam Core

Disbonds, delaminations.

Pitch-Catch

Resonance

Carbon skin to metal Nomex honeycomb

Disbonds, delaminations and crushed core

Pitch-Catch

Resonance

Carbon-Carbon in Heat Shields

Delaminations, cracking, density changes

Pitch-Catch

Resonance

Composite Repair Validation

Disbonds, delaminations

Pitch-Catch

No

Glass fibre skin to foam or wood core

Disbonds, delaminations

Pitch-Catch

Resonance

Metal Skin to metal honeycomb

Disbonds and crushed core

Pitch-Catch

Both

Metal to metal bonded skins

Disbonds  

Both

Pitch-Catch

Perforated metal skin to honeycomb core, used for acoustic liners

Disbonds

Resonance                 

No

Sandwich Structure

Far-side flaws or core damage on sandwich construction

Pitch-Catch

Resonance

Sandwich Structure (multicore)

Inter-core disbonds, core damage

Pitch-Catch

Resonance

0.5”/12.7mm defect

 

Resonance

 

Curved surface up to 1”/25mm

 

Pitch-Catch

Resonance

Depth of indication location in multi-layered structures.

 

Resonance

No

Specification

Transmit

Operating Mode

Pitch-Catch only

Output Frequency Range

1kHz to 100kHz

Main Gain

0 to +76dB, 0.1dB steps

Output Voltage: 3 ranges: ±12V, other TBC

0 to +76dB, 0.1dB steps

Minimum Output drive load impedance

300 Ohms

Waveform Type

Arbitrary waveform, supporting tone burst with rectangular/hanning window and frequency chirp.

Transmit waveform points maximum

8192

Waveform Duration

Maximum 3.2ms

Waveform Output DAC clock rate

2.5MHz fixed

Receive

 

Sample Rate

440kHz (subject to change).

Bit Depth

16 bit.

Gain Range

0 to 60dB (TBC subject to testing)

Receive Bandwidth

3kHz to 1MHz - 3dB points.

Time Base Range

100μs to 2ms

Time Base Delay

0μs to 1ms

Amplitude/Phase Extraction Cursor

Position Resolution 2μs

Software Specification

 

Display Modes

RF Waveform,  Y-T Mode*.

Acquisition Gate in RF Mode parameter control.

With adjustable amplitude, start and parameter control.

Acquisition Gate in Y-T Mode

Multiple box regions.*

Calibration Mode

Performing frequency sweep or bond and dis-bonded areas. Automatic inspection frequency determination with manual adjustment.

Bond/Dis-bond Alarm

State on screen on probe.

Live Waveform

Display during parameter adjustment*

Save

Inspection data to SD card. *

Export

Of inspection report.*

Encoder

With 1D line plot of chosen parameter (phase/amplitude).

Pitch-Catch Probe Specification

 

Operating Frequencies

Depends on piezo resonant frequency.

Current model 30kHz (suitable for 10kHz to 50kHz operation).

Transmit   - receive probe separation

17mm

Transmit   - receive probe linear travel

>5mm

Probe auto-recognition

Yes*

Probe alarm LED

Yes*

Probe tips

Rounded end and flat end, replaceable by user.

Probe housing material

Anodised aluminium case with stainless steel probe housings, rubber finger grip.

Probe connector

8 pin LEMO.