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The BONDCHECK is a multi-mode bond testing flaw detector, providing high speed inspection in pitch-catch, resonance and MIA bond testing modes, with excellent defect sensitivity. All functions are  housed in a single lightweight instrument with a common user interface between the three modes, delivering a simple and intuitive operator led set up. A great all round asset for inspection in the laboratory or under cover as well as out in the field.  BondCheck BlueSc Fl 12cm


Easy to use menus and icon system. 

The BondCheck menu system is simple and fast to navigate. It has the ability to add individually selectable soft key menu items to the sidebar for rapid function access and a “quick-setting menu” for easy set-up, review and adjustment.

With four operator selectable soft keys and a fifth slot for the last menu function used, technicians can quickly modify the system with their preferences. Each saved instrument setting can be associated with a unique, single press set of quick access soft keys. There are also two front panel hard keys that can be readily programmed for rapid single press access to frequently used functions.


Large, daylight readable, configurable colour screen.BondCheck Resonance probe kit

The BondCheck has a large 14.5cm (5.7 Inches) LCD Colour Screen of 640 x 480 pixels providing the operator with excellent signal resolution and presentation together with the choice of configuring their own colour schemes and display types. It is easy to optimise the screen presentation regardless of the lighting conditions. A secondary pane can be configured to create a split screen display or an inset window, with a choice of X-Y spot, frequency sweep, RF waveform and Spectrum displays.                                     


Download the BondCheck Brochure

Download BondCheck Press Release


BondCheck Specification


Operating Mode

Pitch-Catch only

Output Frequency Range

1kHz to 100kHz

Main Gain

0 to +76dB, 0.1dB steps

Output Voltage: 3 ranges: ±12V, other TBC

0 to +76dB, 0.1dB steps

Minimum Output drive load impedance

300 Ohms

Waveform Type

Arbitrary waveform, supporting tone burst with rectangular/hanning window and frequency chirp.

Transmit waveform points maximum


Waveform Duration

Maximum 3.2ms

Waveform Output DAC clock rate

2.5MHz fixed



Sample Rate

440kHz (subject to change).

Bit Depth

16 bit.

Gain Range

0 to 60dB (TBC subject to testing)

Receive Bandwidth

3kHz to 1MHz - 3dB points.

Time Base Range

100μs to 2ms

Time Base Delay

0μs to 1ms

Amplitude/Phase Extraction Cursor

Position Resolution 2μs

Software Specification


Display Modes

RF Waveform,  Y-T Mode*.

Acquisition Gate in RF Mode parameter control.

With adjustable amplitude, start and parameter control.

Acquisition Gate in Y-T Mode

Multiple box regions.*

Calibration Mode

Performing frequency sweep or bond and dis-bonded areas. Automatic inspection frequency determination with manual adjustment.

Bond/Dis-bond Alarm

State on screen on probe.

Live Waveform

Display during parameter adjustment*


Inspection data to SD card. *


Of inspection report.*


With 1D line plot of chosen parameter (phase/amplitude).

Pitch-Catch Probe Specification


Operating Frequencies

Depends on piezo resonant frequency.

Current model 30kHz (suitable for 10kHz to 50kHz operation).

Transmit   - receive probe separation


Transmit   - receive probe linear travel


Probe auto-recognition


Probe alarm LED


Probe tips

Rounded end and flat end, replaceable by user.

Probe housing material

Anodised aluminium case with stainless steel probe housings, rubber finger grip.

Probe connector

8 pin LEMO.